Hiki iā mākou ke hana i nā huaʻōlelo EXW, FOB, CIF, DDU i hiki ke hoʻokō i kāu koi ʻokoʻa
FAQ
Q1.He aha kou manawa alakaʻi?
A: Kūʻai: 5-15 mau lā ma ka laulā.ʻAʻohe waiwai: 15-30 mau lā ma hope o ka hōʻoia ʻana o nā laʻana.A i ʻole e ʻoluʻolu e kelepona mai iā mākou ma ka leka uila no ke kumu manawa alakaʻi kikoʻī i kāu nui kauoha.
Q2.Ke kākoʻo nei ʻoe i nā lawelawe hāpana?Pehea e hiki koke ai iā mākou ke loaʻa kahi laʻana o ka huahana?
A: ʻOiaʻiʻo, No ka hapa nui o nā huahana, loaʻa iā mākou nā laʻana i ka waihona, hiki ke hoʻouna ʻia nā hōʻailona iā ʻoe i loko o hoʻokahi pule.
Q3.Ke ʻae nei ʻoe i ke kauoha OEM a i ʻole ODM?
A: ʻAe, ʻae mākou iā OEM a me ODM.Loaʻa iā mākou kahi hui hoʻomohala ʻoihana no kāu lawelawe hana maʻamau.
Q4.Hiki iā mākou ke hana i kā mākou logo ponoʻī ma nā huahana a me ka pūʻolo?
A: ʻAe, akā pono nā huahana maʻamau e hiki i ka MOQ.
Q5.Pehea ka hana ʻana o kāu hale hana e pili ana i ka mana maikaʻi?
A: ʻO nā huahana kiʻekiʻe ke kumu o ka hoʻomohala ʻana o kā mākou hui a hiki i kēia lā.
1) ʻO nā mea maka a pau a mākou i hoʻohana ai he mau meaʻai me ka BPA-ʻole;
2) Loaʻa iā mākou kā mākou hui R&D no ka hoʻolālā hou a me ka pale patent, no laila mākou e hoʻopili nui i ka maikaʻi o kā mākou huahana;
3) Loaʻa iā mākou kahi hui QA / QC ʻoihana e hōʻoia i ka maikaʻi.